ADHESIVE SOLUTIONS

Electronic Adhesives

Electronic Adhesives > COREBOND T SERIES


Dispense Adhesive

Holder attach

Thermal Curing
Taekwang Fine Chemical’s thermal adhesives can be cured at low temperature and short time for various materials, hence it can prevent damage of some parts which are susceptible to heat in the camera module.

Taekwang’s T-series adhesive can provide adhesive with consistent quality to customers needed low-temperature and high adhesion curing process.


  • Low-temperature curability
  • Controlled flowability of adhesive for customers.
  • Low shrinkage
  • Excellent adhesion for various materials
  • Providing constant quality of adhesive
Product Application Viscosity
(cps @25℃)
Ti Tg
(℃)
Work life
(days)
Curing Condition Property
T1241 Housing
Assembly
20,000 4.5 36 3 100℃ 3min snap cure
80℃ 20min oven cure
Fast Curing
High adhesion.
T1361 Housing
Assembly
30,000 6 37 3 100℃ 3min snap cure
80℃ 20min oven cure
Fast Curing
High viscosity.
T1251 Housing
Assembly
24,000 5 52 2 120℃ 40sec snap cure
70℃ 20min oven cure
Very Fast Curing
High adhesion
T1131 Housing
Assembly
9,000 3.5 37 2 120℃ 40sec snap cure
70℃ 20min oven cure
Very Fast Curing
Low viscosity
T8300 Housing
Assembly
15,000 3.0 100 3 85℃ 60min oven cure High Tg (100℃)
High modulus