ADHESIVE SOLUTIONS

Electronic Adhesives

Electronic Adhesives > COREBOND H SERIES



Dispense Adhesive

Barrel Attach

UV Curing

Thermal Curing

Adjust Barrel

Thermal Curing

UV Curing
Active alignment system has been used mainly in the camera module assemble process to meet high array accuracy between lens and sensor in the camera module
The UV-Thermal hybrid adhesive can be a good candidate for active alignment

It can give temporary adhesion for a lens with a UV cure to get the right position to prohibit tilt problem between lens and sensor within a produce(production) line and it has full adhesion after secondary thermal cure

The UV-Thermal hybrid adhesive of Taekwang Fine Chemical has good properties for an active alignment system.


  • Low shrinkage
  • Low CTE
  • Excellent adhesion to engineering plastics
  • Controlled Viscosity and Thixotropy for active alignment
Product Application Viscosity
(cps @25℃)
Ti Tg
(℃)
Work life
(days)
Curing Condition Property
H1642 Active
Alignment
30,000 2.2 92 3 UV @365nm 500mW*2sec
80℃ 30min oven cure
Good adhesion
High Tg, Low CTE
Beige color
H1645 Active
Alignment
30,000 1.7 100 3 UV @365nm 500mW*2sec
80℃ 30min oven cure
Good shear strength
High Tg, Low CTE
Beige color
H1885 Active
Alignment
55,000 4.5 90 3 UV @365nm 500mW*2sec
80℃ 30min oven cure
Good adhesion
High Tg, Low CTE
Black color
H1886 Active
Alignment
55,000 4.5 98 3 UV @365nm 500mW*2sec
80℃ 30min oven cure
Good shear strength
High Tg, Low CTE
Black color
H1890 Active
Alignment
76,000 3.5 55 3 UV @365nm 500mW*2sec
80℃ 30min oven cure
Excellent adhesion
Low CTE
Black color