Components in the camera module are easily damaged from impact so they need impact resistance necessarily
Underfill adhesive can penetrate into the gap of both substrate and chip from the side by its flowability control.
F-series adhesive has not only to impact resistance to protect parts of the module but also easily penetrates into the gap.
Taekwang Fine Chemical’s F-series adhesive supports the stable process from the constant quality of adhesive.
Controlled modulus for difference of substrate CTE