ADHESIVE SOLUTIONS

Electronic Adhesives

Electronic Adhesives > COREBOND F SERIES


Dispense Adhesive

Thermal Curing
Components in the camera module are easily damaged from impact so they need impact resistance necessarily
Underfill adhesive can penetrate into the gap of both substrate and chip from the side by its flowability control.
F-series adhesive has not only to impact resistance to protect parts of the module but also easily penetrates into the gap.

Taekwang Fine Chemical’s F-series adhesive supports the stable process from the constant quality of adhesive.


  • Low shrinkage
  • Excellent flowability
  • Controlled modulus for difference of substrate CTE
Product Application Viscosity
(cps @25℃)
Ti Tg
(℃)
Work life
(days)
Curing Condition Property
F9201 Barrel attach 2,300 0.9 37 3 80℃ 30min oven cure Fast Curing
Excellent adhesion
Good Flowability
F9201B Barrel attach 2,300 0.9 37 3 80℃ 30min oven cure Fast Curing
Excellent adhesion
Good Flowability
F9700 Barrel attach 3,000 0.9 35 3 80℃ 30min oven cure Fast Curing
Good Flowability
F9702 Barrel attach 5,300 0.9 31 3 80℃ 30min oven cure Low CTE
Fast Curing